Morphological and microstructural properties of two-phase Ni-Cu films electrodeposited at different electrolyte temperatures
Identifieur interne : 000875 ( Main/Repository ); précédent : 000874; suivant : 000876Morphological and microstructural properties of two-phase Ni-Cu films electrodeposited at different electrolyte temperatures
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Abstract
In this study, Ni-Cu films are grown on ITO (indium tin oxide) coated glass substrates by electrodeposition technique at various electrolyte temperatures, and then surface morphology and structural properties have been studied in detail. The X-ray diffraction (XRD) patterns revealed the existence of Cu-rich and Ni-rich phases in the Ni-Cu films. Besides, microstructural parameters such as crystallite size and crystallographic texture were also calculated from the XRD patterns. Compositional analysis on the Ni-Cu films carried out using energy dispersive X-ray spectroscopy (EDX) indicated that the Cu content within the film increases with increasing electrolyte temperature. Scanning electron microscopy (SEM) and atomic force microscopy (AFM) were used to investigate the surface morphological structure of Ni-Cu films. It was found that the surface morphology of Ni-Cu films exhibits a strong dependence on the temperature of the electrolyte. It was also found that the surface roughness of the Ni-Cu films increases with increasing electrolyte temperature. The texture aspect parameter and texture direction index were obtained for isotropy/anisotropy surface texture. For all Ni-Cu films deposited at different electrolyte temperatures, the surface texture was found to be isotropic.
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<record><TEI><teiHeader><fileDesc><titleStmt><title xml:lang="en" level="a">Morphological and microstructural properties of two-phase Ni-Cu films electrodeposited at different electrolyte temperatures</title><author><name sortKey="Sarac, Umut" uniqKey="Sarac U">Umut Sarac</name><affiliation wicri:level="1"><inist:fA14 i1="01"><s1>Department of Elementary Education, Bartín University</s1><s2>Bartín 74100</s2><s3>TUR</s3><sZ>1 aut.</sZ></inist:fA14><country>Turquie</country><wicri:noRegion>Bartín 74100</wicri:noRegion></affiliation></author><author><name sortKey="Celalettin Baykul, M" uniqKey="Celalettin Baykul M">M. Celalettin Baykul</name><affiliation wicri:level="1"><inist:fA14 i1="02"><s1>Department of Physics, Faculty of Arts and Science, Eskişehir Osmangazi University</s1><s2>Eskişehir 26480</s2><s3>TUR</s3><sZ>2 aut.</sZ></inist:fA14><country>Turquie</country><wicri:noRegion>Eskişehir 26480</wicri:noRegion></affiliation></author></titleStmt><publicationStmt><idno type="inist">13-0127850</idno><date when="2013">2013</date><idno type="stanalyst">PASCAL 13-0127850 INIST</idno><idno type="RBID">Pascal:13-0127850</idno><idno type="wicri:Area/Main/Corpus">001070</idno><idno type="wicri:Area/Main/Repository">000875</idno></publicationStmt><seriesStmt><idno type="ISSN">0925-8388</idno><title level="j" type="abbreviated">J. alloys compd.</title><title level="j" type="main">Journal of alloys and compounds</title></seriesStmt></fileDesc><profileDesc><textClass><keywords scheme="KwdEn" xml:lang="en"><term>Atomic force microscopy</term><term>Copper alloys</term><term>Deposition process</term><term>Dispersive spectrometry</term><term>Electrodeposition</term><term>Microstructure</term><term>Nickel alloys</term><term>Roughness</term><term>Scanning electron microscopy</term><term>Surface morphology</term><term>Surface texture</term><term>Transition element alloys</term><term>XRD</term></keywords><keywords scheme="Pascal" xml:lang="fr"><term>Microstructure</term><term>Dépôt électrolytique</term><term>Morphologie surface</term><term>Diffraction RX</term><term>Spectrométrie dispersive</term><term>Texture surface</term><term>Microscopie électronique balayage</term><term>Microscopie force atomique</term><term>Procédé dépôt</term><term>Rugosité</term><term>Nickel alliage</term><term>Cuivre alliage</term><term>Métal transition alliage</term></keywords></textClass></profileDesc></teiHeader><front><div type="abstract" xml:lang="en">In this study, Ni-Cu films are grown on ITO (indium tin oxide) coated glass substrates by electrodeposition technique at various electrolyte temperatures, and then surface morphology and structural properties have been studied in detail. The X-ray diffraction (XRD) patterns revealed the existence of Cu-rich and Ni-rich phases in the Ni-Cu films. Besides, microstructural parameters such as crystallite size and crystallographic texture were also calculated from the XRD patterns. Compositional analysis on the Ni-Cu films carried out using energy dispersive X-ray spectroscopy (EDX) indicated that the Cu content within the film increases with increasing electrolyte temperature. Scanning electron microscopy (SEM) and atomic force microscopy (AFM) were used to investigate the surface morphological structure of Ni-Cu films. It was found that the surface morphology of Ni-Cu films exhibits a strong dependence on the temperature of the electrolyte. It was also found that the surface roughness of the Ni-Cu films increases with increasing electrolyte temperature. The texture aspect parameter and texture direction index were obtained for isotropy/anisotropy surface texture. For all Ni-Cu films deposited at different electrolyte temperatures, the surface texture was found to be isotropic.</div></front></TEI><inist><standard h6="B"><pA><fA01 i1="01" i2="1"><s0>0925-8388</s0></fA01><fA03 i2="1"><s0>J. alloys compd.</s0></fA03><fA05><s2>552</s2></fA05><fA08 i1="01" i2="1" l="ENG"><s1>Morphological and microstructural properties of two-phase Ni-Cu films electrodeposited at different electrolyte temperatures</s1></fA08><fA11 i1="01" i2="1"><s1>SARAC (Umut)</s1></fA11><fA11 i1="02" i2="1"><s1>CELALETTIN BAYKUL (M.)</s1></fA11><fA14 i1="01"><s1>Department of Elementary Education, Bartín University</s1><s2>Bartín 74100</s2><s3>TUR</s3><sZ>1 aut.</sZ></fA14><fA14 i1="02"><s1>Department of Physics, Faculty of Arts and Science, Eskişehir Osmangazi University</s1><s2>Eskişehir 26480</s2><s3>TUR</s3><sZ>2 aut.</sZ></fA14><fA20><s1>195-201</s1></fA20><fA21><s1>2013</s1></fA21><fA23 i1="01"><s0>ENG</s0></fA23><fA43 i1="01"><s1>INIST</s1><s2>1151</s2><s5>354000502447150330</s5></fA43><fA44><s0>0000</s0><s1>© 2013 INIST-CNRS. All rights reserved.</s1></fA44><fA45><s0>54 ref.</s0></fA45><fA47 i1="01" i2="1"><s0>13-0127850</s0></fA47><fA60><s1>P</s1></fA60><fA61><s0>A</s0></fA61><fA64 i1="01" i2="1"><s0>Journal of alloys and compounds</s0></fA64><fA66 i1="01"><s0>GBR</s0></fA66><fC01 i1="01" l="ENG"><s0>In this study, Ni-Cu films are grown on ITO (indium tin oxide) coated glass substrates by electrodeposition technique at various electrolyte temperatures, and then surface morphology and structural properties have been studied in detail. The X-ray diffraction (XRD) patterns revealed the existence of Cu-rich and Ni-rich phases in the Ni-Cu films. Besides, microstructural parameters such as crystallite size and crystallographic texture were also calculated from the XRD patterns. Compositional analysis on the Ni-Cu films carried out using energy dispersive X-ray spectroscopy (EDX) indicated that the Cu content within the film increases with increasing electrolyte temperature. Scanning electron microscopy (SEM) and atomic force microscopy (AFM) were used to investigate the surface morphological structure of Ni-Cu films. It was found that the surface morphology of Ni-Cu films exhibits a strong dependence on the temperature of the electrolyte. It was also found that the surface roughness of the Ni-Cu films increases with increasing electrolyte temperature. The texture aspect parameter and texture direction index were obtained for isotropy/anisotropy surface texture. For all Ni-Cu films deposited at different electrolyte temperatures, the surface texture was found to be isotropic.</s0></fC01><fC02 i1="01" i2="3"><s0>001B80A15P</s0></fC02><fC02 i1="02" i2="3"><s0>001B60H55J</s0></fC02><fC02 i1="03" i2="3"><s0>001B60H35B</s0></fC02><fC03 i1="01" i2="3" l="FRE"><s0>Microstructure</s0><s5>02</s5></fC03><fC03 i1="01" i2="3" l="ENG"><s0>Microstructure</s0><s5>02</s5></fC03><fC03 i1="02" i2="3" l="FRE"><s0>Dépôt électrolytique</s0><s5>03</s5></fC03><fC03 i1="02" i2="3" l="ENG"><s0>Electrodeposition</s0><s5>03</s5></fC03><fC03 i1="03" i2="3" l="FRE"><s0>Morphologie surface</s0><s5>04</s5></fC03><fC03 i1="03" i2="3" l="ENG"><s0>Surface morphology</s0><s5>04</s5></fC03><fC03 i1="04" i2="3" l="FRE"><s0>Diffraction RX</s0><s5>05</s5></fC03><fC03 i1="04" i2="3" l="ENG"><s0>XRD</s0><s5>05</s5></fC03><fC03 i1="05" i2="X" l="FRE"><s0>Spectrométrie dispersive</s0><s5>07</s5></fC03><fC03 i1="05" i2="X" l="ENG"><s0>Dispersive spectrometry</s0><s5>07</s5></fC03><fC03 i1="05" i2="X" l="SPA"><s0>Espectrometría dispersiva</s0><s5>07</s5></fC03><fC03 i1="06" i2="3" l="FRE"><s0>Texture surface</s0><s5>08</s5></fC03><fC03 i1="06" i2="3" l="ENG"><s0>Surface texture</s0><s5>08</s5></fC03><fC03 i1="07" i2="3" l="FRE"><s0>Microscopie électronique balayage</s0><s5>09</s5></fC03><fC03 i1="07" i2="3" l="ENG"><s0>Scanning electron microscopy</s0><s5>09</s5></fC03><fC03 i1="08" i2="3" l="FRE"><s0>Microscopie force atomique</s0><s5>10</s5></fC03><fC03 i1="08" i2="3" l="ENG"><s0>Atomic force microscopy</s0><s5>10</s5></fC03><fC03 i1="09" i2="X" l="FRE"><s0>Procédé dépôt</s0><s5>11</s5></fC03><fC03 i1="09" i2="X" l="ENG"><s0>Deposition process</s0><s5>11</s5></fC03><fC03 i1="09" i2="X" l="SPA"><s0>Procedimiento revestimiento</s0><s5>11</s5></fC03><fC03 i1="10" i2="3" l="FRE"><s0>Rugosité</s0><s5>12</s5></fC03><fC03 i1="10" i2="3" l="ENG"><s0>Roughness</s0><s5>12</s5></fC03><fC03 i1="11" i2="3" l="FRE"><s0>Nickel alliage</s0><s5>17</s5></fC03><fC03 i1="11" i2="3" l="ENG"><s0>Nickel alloys</s0><s5>17</s5></fC03><fC03 i1="12" i2="3" l="FRE"><s0>Cuivre alliage</s0><s5>18</s5></fC03><fC03 i1="12" i2="3" l="ENG"><s0>Copper alloys</s0><s5>18</s5></fC03><fC03 i1="13" i2="3" l="FRE"><s0>Métal transition alliage</s0><s5>48</s5></fC03><fC03 i1="13" i2="3" l="ENG"><s0>Transition element alloys</s0><s5>48</s5></fC03><fN21><s1>105</s1></fN21></pA></standard></inist></record>Pour manipuler ce document sous Unix (Dilib)
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